Avishtech to join Altiumâs Nexar Partner Ecosystem Avishtech, a provider of EDA stack-up and 2D field solver solutions, has joined Altiumâs Nexar partner ecosystem.
The company joins a growing list of Nexar partner organizations, including Arduino, Arrow, Diotech, Keysight Technologies, Microchip, Samtec, and Ultra Librarian.
Nexar partners are working to transform the electronics design, development, and manufacturing process moving from isolated toolchains and disconnected processes into a more streamlined, next-generation workflow that is connected by a comprehensive data model for printed circuit boards. Nexar software partners connect mechanical CAD, CAM, CAE, PLM, and other applications that are relevant in the design and realisation of electronics to the Altium 365 cloud platform.
Avishtech To Join Altium s Nexar Partner Ecosystem – EEJournal eejournal.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from eejournal.com Daily Mail and Mail on Sunday newspapers.
1991 M.Sc., Department
of Industrial Engineering of Forestry, Black Sea Technical University, Turkey 1988 B.Sc., Department of Industrial Engineering of
Forestry, Black Sea Technical University, Turkey
Publications (selected) Efe, FT Alma, MH, 2014. Investigating Some Physical
Properties of Composite Board, Produced from Sunflower Stalks, Designed
Horizontally, Ekoloji, 23 (90): 40-48. Alma M. H.; Acemioğlu, B. (2003): A Kinetic Study of
Sulfuric-Acid-Catalyzed Liquefaction of Wood into Phenol Chemical Engineering
Communications . 191: 969-980. Alma, M.H.; Basturk M. A.; Dıgrak M. (2003): New
Polyurethane-Type Rigid Foams From Liquified Wood Powders Journal of Materıals
Scıence Letters 22, 1225 –1228. Bektaş, I; Alma M. H.; As, N.; Gundoğan R. (2003):
Application of water and release agent
The task
Increasing productivity, lowering material consumption
To quickly activate the adhesive with wood fibreboards, steam is pressed into the briquette. The so-called steam shock makes high moisture of the entire fibre material unnecessary and optimises the quality of the boards. In addition, the fibre cake must not adhere to the mould substrate nor the press when it is loaded on the transport belt to prevent soiling the system. The task consist of applying water precision-metered on the fibre cake to reach these effects.
Application of water
The so-called steam shock activates the adhesive more quickly and reduces the pressing time. This results in higher production speeds and greater board density or smoother surface. In turn, this reduces sanding or grinding processes and lowers the material consumption.