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January 18, 2023
MIT engineers fabricated 2D materials that could lead to next-generation transistors and electronic films.
June 14, 2022
The design comprises alternating layers of sensing and processing elements.
June 13, 2022
MIT engineers built a LEGO-like artificial intelligence chip, with a view toward sustainable, modular electronics. The chip can be reconfigured, with layers that can be swapped out or stacked on, such as to add new sensors or updated processors.