Embedded Active System Integration News Today : Breaking News, Live Updates & Top Stories | Vimarsana

Share: ResearchAndMarkets.com s offering. The embedded die packaging market was valued at USD 52.3 billion in 2020 and is expected to reach USD 175.27 billion by 2026 has been expected to grow at a CAGR of 22.4% during the forecast period (2021 - 2026). 3D packaging with embedded die solutions has become more attractive as an integration tool for next-generation devices which will become a key trend in future. Growing miniaturization of devices is driving the market as products are becoming increasingly smaller and embed more functionality. Micromachining and nanotechnology play an increasingly important role in the miniaturization of components ranging from biomedical applications to chemical microreactors and sensors. For instance, Bluetooth wifi modules requires minimal circuit board area on today s high-density mobile devices.

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