Semtech and SAS Democratize IoT Solutions for a Better World
By leveraging the LoRaWAN® standard and SAS AI and Streaming Analytics, the companies will offer a robust suite of solutions to solve real world problems and improve quality of life for people around the globe
Universal Edge-to-Cloud solutions combine LoRaWAN, SAS Analytics for IoT and Microsoft Azure
CAMARILLO, Calif. , May 19, 2021 – Semtech Corporation (Nasdaq: SMTC), a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, and SAS, the leader in massively parallel analytics and AI, are working together to deliver innovative Edge-to-Cloud IoT solutions that accelerate intelligent decisions for a smarter, safer planet. The end-to-end solutions incorporating LoRaWAN® connectivity with the industry leading SAS IoT analytics platform will simplify the development of IoT solutions that are focused on solving some of the biggest challenges facing the world to
Share this article
Share this article
ResearchAndMarkets.com s offering.
The global automotive hypervisor market is estimated to grow at a CAGR of 39.3% during the forecast period to reach USD 704 million by 2026 from an estimated USD 134 million in 2021.
Adoption of advanced features in vehicles and the rise in adoption of connected cars would drive the growth of the automotive hypervisor market. Also, virtualized hypervisor layer in in-vehicle infotainment reduces the complexity of the electrical architecture of vehicles. However, the lack of standard protocol to develop software platforms for automotive applications is a major restraint for the growth of the automotive hypervisor market.
Taiwan Excellence strengthens commitment to India s digital mission during pandemic technuter.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from technuter.com Daily Mail and Mail on Sunday newspapers.
5 days ago
340 Views
Xilinx announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions.
With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.
As the world’s only hardware adaptable cost-optimised portfolio based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC’s state-of-the-art InFO (Integrated Fan-Out) packaging technology. Using InFO, Artix and Zynq UltraScale+ devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.
Questex Announces Sensors Converge 2021 this June 22-24 in San Jose, California – Where Design Innovation Meets Tech Innovation One event covering the biggest design engineering trends
February 10, 2021 10:00 ET | Source: Questex LLC Questex LLC New York, New York, UNITED STATES
NEW YORK, Feb. 10, 2021 (GLOBE NEWSWIRE) Questex and the Fierce Technology Group announced today Sensors Converge 2021, a live, in-person experience, June 22-24, 2021 at the McEnery Convention Center in San Jose, California, where the design engineering community can come together safely, to network, share ideas, discover technologies, and define the future roadmap for the sensors and electronics industry. From sensors and chips to the cloud, Sensors Converge will cover the technologies and applications driving innovation today.