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for semiconductor innovation
Paris, and Bernin (Grenoble), France, December 17, 2020. – The French Government has granted the REFERENCE consortium led by Soitec, a world leader in semiconductor materials based in France, the Étoile de l Europe ( Star of Europe ) award for innovation in telecommunication.
Based on the Silicon on Insulator substrate technology, REFERENCE, a project funded by the ECSEL Joint Undertaking
1, has developed industrial solutions for communication applications.
Frédérique Vidal, France s Minister of Higher Education, Research, and Innovation, awarded the consortium, recognizing
the emergence of a strong European network, which underpins France s role as a motor of Europe s technological autonomy. T
Paris
France-general
France
Abernin
Rhôalpes
French
Emmanuel-sabonnadi
Steve-babureck
Soitec-euronext
Paul-boudre
Substrate-innovation-center
European-research
France awards Soitec-led European consortium for semiconductor innovation
France awards Soitec-led European consortium
for semiconductor innovation
Paris, and Bernin (Grenoble), France, December 17, 2020. – The French Government has granted the REFERENCE consortium led by Soitec, a world leader in semiconductor materials based in France, the “Étoile de l’Europe” (“Star of Europe”) award for innovation in telecommunication.
Based on the Silicon on Insulator substrate technology, REFERENCE, a project funded by the ECSEL Joint Undertaking
1, has developed industrial solutions for communication applications.
Frédérique Vidal, France’s Minister of Higher Education, Research, and Innovation, awarded the consortium, recognizing
“
the emergence of a strong European network, which underpins France’s role as a motor of Europe’s technological autonomy. T
Paris
France-general
France
Abernin
Rhôalpes
French
Emmanuel-sabonnadi
Steve-babureck
Soitec-euronext
Paul-boudre
Substrate-innovation-center
European-research
Aledia produces first nanowire chips on 300mm silicon wafers Aledia, a French start-up developing a disruptive technology for microLED displays, has manufactured the worldâs first microLED chips produced on 300mm (12â) silicon wafers.
The company, which developed its technology on 200mm (8â) silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers. The larger wafers provide better economic payoff and cost-effective integration with smaller-node electronics, which are only available on 300mm silicon wafers.
Aledia was spun out of CEA-Leti, a French research institute pioneering micro- and nanotechnologies, in 2012, and the work on 300mm wafers has been performed by joint Aledia and CEA-Leti teams.
France
French
Emmanuel-sabonnadi
Giorgio-anania
பிரான்ஸ்
பிரஞ்சு
ஜார்ஜியோ-அனானியா
Aledia produces its first nanowire chips on 300mm silicon wafers
16 Dec 2020
After several years in stealth mode, French developer of microLED displays is now using CEA-Leti pilot lines.
The company, which has been developing its technology on 200mm (8in) silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers.
Aledia says that the larger wafers provide better economic payoff and cost-effective integration with smaller-node electronics, which are only available on 300mm silicon wafers. In 2012, the company was spun out of French research institute CEA-Leti, which develops micro- and nanotechnologies. The work on 300mm wafers has been performed by joint Aledia and CEA-Leti teams.
France
French
Emmanuel-sabonnadi
Giorgio-anania
பிரான்ஸ்
பிரஞ்சு
ஜார்ஜியோ-அனானியா
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