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SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University for R&D Selects Indiana for strong support provided by the state and local government, infrastructure for manufacturing, and talent at Purdue. Industrys first investment in advanced packaging for AI products on American soil, strengthens supply-chain resilience SEOUL, South Korea, April 4, 2024 /PRNews...
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