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Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes

SAN JOSE, Calif., May 27, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is expanding its collaboration with TSMC to accelerate mobile, AI and hyperscale computing application design using the integrated Cadence® digital flow and custom/analog tool suite on TSMC’s N3 and N4 process technologies. Joint Cadence and TSMC customers have already successfully…
Chin Chi Teng Suk Lee Digital Signoff Group At Cadence Design Infrastructure Management Division Cadence Design Systems Inc Companies To Work

Cadence Collaborates with Arm to Accelerate Hyperscale Computing, 5G Communications SoC Development

Cadence Collaborates with Arm to Accelerate Hyperscale Computing, 5G Communications SoC Development Cadence Design Systems, Inc. announced that it is expanding its collaboration with Arm to speed hyperscale computing and 5G communications SoC development using Cadence® tools and the new Arm® Neoverse™ V1 and Neoverse N2 platforms. To build upon previous silicon successes where leading customers used the first-generation Arm...
Chris Bergey Chin Chi Teng Ghz Neoverse Software Solution Digital Signoff Group At Cadence Cadence Design Systems Inc

Cadence Collaborates with Arm to Accelerate Hyperscale Computing and 5G Communications SoC Development

Highlights: Latest collaboration builds upon previous successes where leading server customers reached silicon on 7nm using the previous-generation Arm Neoverse N1 platform and Cadence tools Cadence optimized its RTL-to-GDS digital full flow and delivered corresponding 5nm and 7nm RAKs for Arm Neoverse V1 and Neoverse N2 platforms, enabling designers to get to market faster Cadence’s verification full flow enables Neoverse V1 and Neoverse N2 platform users to achieve highest verification thro...
Chris Bergey Chin Chi Teng Ghz Neoverse Software Solution Digital Signoff Group At Cadence Cadence Design Systems Inc

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