Circuits Assembly Online Magazine - Indium Corporation Experts to Present at Electronics Packaging Technology Conference
The upcoming Electronics Packaging Technology Conference (EPTC) will feature presentations by two Indium Corporation experts. The conference, which takes place December 7–9 in Singapore, covers the complete spectrum of electronics packaging technology.
Demi Yao Tyler Hanes Electronics Packaging Technology Conference Nihon Superior Co Level Interconnect In Semiconductor Packaging Indium Corporation
Source: circuitsassembly.com