I feel like the rabbit in Alice in Wonderland who is always short on time… Due to that, I may or may not be able to pack together a second Zen 4 part, that will depend on the launch coverage of it. Nevertheless, I would like to share an interesting overview of the Zen evolution from Zen 1 to the upcoming Zen 4:
Over the last two issues, we’ve described the history of integrated circuits (ICs), the manufacturing process, process nodes, wafer sizes and EUV lithography. Along with EUV, another technology that is just maturing and has fundamentally changed the way high-end ICs are made is multi-chip modules. We shall now investigate that and other cutting-edge chip technologies. by Dr David Maddison
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In January, AMD announced the Ryzen 7 5800X3D and scheduled it for a Spring release. Last week, several sources said it would come to market in mid-April.