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SEOUL, South Korea, April 25, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it recorded 12.43 trillion won in

SK hynix and TSMC sign MOU to collaborate on HBM4 development and next-generation packaging technologySK hynix will adopt TSMC's cutting-edge foundry process to advance HBM4 performanceProduct Design-Foundry-Memory

The companys facility for AI memory chips marks the largest single economic development in the history of the state...

WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion...

WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg and Purdue University P...

SK hynix Commercializes Worlds Fastest Mobile DRAM LPDDR5T

First to offer industry's largest 24GB capacity; Begins supplying product to a global smartphone manufacturerIntegrates HKMG process, enabling the product to deliver both ultra-low power consumption and high

/PRNewswire/ -- SK hynix Inc. (or "the company", https://www.skhynix.com/) showcased today the sample of the 321-layer 4D NAND, making public the progress on...

Obtains internationally recognized ASPICE Level 2 Certification through collaboration with SiemensAims to meet growing demand from automotive chip market, improve profitability with globally recognized NAND

/PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com ) announced today that it has started mass production of its 238-layer 4D NAND Flash memory,...