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Samsung archrival discloses more details about key AI memory tech that could end up in Nvidia s purported H300 — HBM4 will have the same die density but 16 layers, a whopping 1 65TBps bandwidth and will be available in 48GB SKUs

China s $47B semiconductor fund puts chip sovereignty front and center

China has closed a third state-backed investment fund to bolster its semiconductor industry and reduce reliance on other nations, both for using and for

Samsung denies claims its HBM3E memory failed NVIDIA s quality tests for AI GPUs

Samsung denies media reports that its HBM products failed to meet NVIDIA's strict quality standards, which cited excessive heat generation and power usage.

Hanmi Semiconductor expands further after securing Micron, SK Hynix orders

Hanmi Semiconductor s new plant has been operational for just over a month, and the company has started expanding further. They aim to accelerate the production capacity of High-Bandwidth Memory (HBM) equipment, specifically the TC Bonder, a move that has garnered significant attention.

Samsung s HBM lag threatens memory chip dominance in AI Era

Despite Samsung Electronics recently appointing a new leader for its Device Solutions (DS) division that comprises memory and foundry units, the company s lag behind SK Hynix in leading the High Bandwidth Memory (HBM) market could become a major obstacle to its semiconductor business amid the widespread adoption of Artificial Intelligence (AI), as noted by industry insiders in South Korea.

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