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Centre to approve several chip packaging, fabrication plant proposals soon: MoS IT

New Delhi, June 1 (IANS): The government will approve multiple semiconductor packaging and fabrication plant proposals in the coming weeks, Union Minister of State for Electronics and IT, Rajeev Chandrasekhar, said on Thursday as the Centre reopened the w
New Delhi Narendra Modi Rajeev Chandrasekhar Semiconductor Association Counterpoint Research India Electronics

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