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Intel aims to put a trillion transistors in a chip package by 2030 #newkerala(101844)

Intel aims to put a trillion transistors in a chip package by 2030 #newkerala(101844)
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San franciscoUnited statesMark gardnerAnn kelleherIntel technology developmentIntel foundry servicesFoundry advanced packaging

Intel aims to put a trillion transistors in a chip package by 2030

Intel aims to put a trillion transistors in a chip package by 2030
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San franciscoUnited statesAnn kelleherMark gardnerIntel technology developmentIntel foundry servicesFoundry advanced packaging

Intel Shows Close-Ups of Next-Gen Granite Rapids Xeon & Meteor Lake Client CPUs Using Advanced Packaging Tech

Intel has given a close-up of its next-gen Meteor Lake client & Granite Rapids data center CPUs which utilize advanced packaging technologies.

United statesGranite rapidsSapphire rapidsAnn kelleherPonte vecchioTest technology developmentIntel technology developmentIntel corporationIntel foundry servicesIntel assemblyData centerMeteor lakeP core based granite rapidsE core based sierraBirch stream

Intel Shows New Stacked CFET Transistor Design At ITF World

Intel’s Ann Kelleher showed a render of the new Complementary FET (CFET) transistor during her presentation at imec’s ITF World conference.

Ann kelleherApplied materialsInteruniversity microelectronics centreIntel technology developmentSystem technology coTechnology developmentSystem technology co optimization

Intel (INTC) Appoints Stuart Pann as Head of Intel Foundry Services

Intel (INTC) Appoints Stuart Pann as Head of Intel Foundry Services
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Michigan technological universityUnited statesErin tyrrellPat gelsingerStuart pannWilliam mossRandhir thakurIntel corporate planning groupIntel corporationIntel foundry servicesIntel business management groupUniversity of michiganAcceleration officeIntel technology developmentWall streetCorporate planning