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SK hynix invests $3.87 billion in new facility

Our selection of industry specific magazines cover a large range of topics.

SK hynix signs investment agreement of advanced chip packaging

Our selection of industry specific magazines cover a large range of topics.

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

SK hynix to Invest $3.9B in Indiana HBM Fab and R&D with Purdue - High-Performance Computing News Analysis

Memory chip company SK hynix announced it will invest $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D [...]

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

/PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com), the world's leading producer of High-Bandwidth Memory (HBM) chips, announced today that it...

Maker of AI chip announces $3.87B facility, largest-ever investment in Indiana

Purdue's president said SK Hynix's investment would be the largest ever in Indiana and move the state to the forefront of AI in America.

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University for R&D Selects Indiana for strong support provided by the state and local government, infrastructure for manufacturing, and talent at Purdue. Industry's first investment in advanced packaging for AI products on American soil, strengthens supply-chain resilience SEOUL, South Korea, April 4, 2024 /PRNews...

New Whitepaper Outlines How AI Can Help Build the Green Energy Grid of Tomorrow and Power the EV Revolution

Paper proposes practical near-term solutions to improve the reliability of the U.S. grid and support the nation's transition to electric vehicles ...