Transparency Market Research: Wire Bonding Market to Expand at CAGR of 2.9%; Advent of Novel Ultrasonic and Thermosonic Bonding Methods to Boost Market Growth, notes TMR Study
- Proliferation of the consumer electronics sector offers value-grab opportunities for manufacturers in the wire bonding market - Extensive demand from semiconductor packaging, microelectronics
United States Rohit Bhisey Asia Pacific Wurth Electronik Gmbh Co Amkor Technology Inc Technology Holding Co
Source: finanznachrichten.de