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Highlights: • Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit • Designers can achieve system-driven PPA through the availability of integrated thermal, power and static timing analysis capabilities • Cadence’s third-generation 3D-IC solution supports a wide range of application areas including, hyperscale computing, consumer, 5G communications, mobile and automotive…

SAN JOSE, Calif., Oct. 7, 2021 — Cadence Design Systems, Inc. announced the delivery of the Cadence Integrity 3D-IC platform, the industry’s first