MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai
The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce ALPHA® OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.
ALPHA OM-372 is designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components. ALPHA OM-372 is formulated to deliver low post reflow residue and superior transfer efficiency on fine feature pads as low as 80x130µm (008004). A combination of these best-in-class features as well as excellent HIP and NWO performance makes it ideal for a broad range of high board density applications requiring smaller, thinner, and lighter form factor components.
Printer Version MacDermid Alpha to Promote Latest Interconnect Tech, Present on Microvia Reliability at 2021 Virtual IPC APEX EXPO
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
The Circuitry Solutions division will highlight the Affinity family of ENIG and ENEPIG final finishes, including their new reduction assisted gold plating process Affinity 3.0, as well as their complete line of leading-edge metallization processes for exceptionally reliable copper filled microvias. Additional details about the newly installed final finish pilot line at their Waterbury, CT Innovation Center and accompanying partnership initiative will be provided.
MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding Materials
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Both ALPHA HiTech CU21-3240 and ALPHA HiTech CU31-2030 are one-component capillary underfills which are designed for the protection of assembled chip packages onto printed circuit boards, providing excellent reliability performance. ALPHA HiTech CU21-3240 exhibits good thermal cycling performance due to its low coefficient of thermal expansion. It is suitable for applications wi