MacDermid Alpha to Promote Latest Interconnect Tech, Present on Microvia Reliability at 2021 Virtual IPC APEX EXPO
Printer Version MacDermid Alpha to Promote Latest Interconnect Tech, Present on Microvia Reliability at 2021 Virtual IPC APEX EXPO MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021. The Circuitry Solutions division will highlight the Affinity family of ...
Bill Bowerman Hitech Underfill Macdermid Alpha Macdermid Alpha Electronics Solutions Assembly Solutions Ct Innovation Center
Source: iconnect007.com