NXP and TSMC jointly develop embedded MRAM IP in TSMC 16 nm FinFET technology With MRAM, carmakers can more efficiently roll out new features, accelerate over-the-air (OTA) updates and remove production bottlenecks NXP’s next generation of S32 zonal processors and general purpose automotive MCUs are scheduled to be the first product to sample in early 2025 Eindhoven,…
NXP Semiconductors is collaborating with TSMC to deliver the industry’s first automotive embedded MRAM (Magnetic Random Access Memory) in 16 nm FinFET technology. As automakers transition to software-defined vehicles (SDVs), they need to support multiple generations of software upgrades on a single hardware platform. Bringing together NXP’s high-performance S32 automotive.
NXP Semiconductors (NASDAQ: NXPI), the world leader in automotive processing, today announced its collaboration with TSMC to deliver the industry’s first automotive embedded MRAM (Magnetic Random Access Memory) in 16 nm FinFET technology.
16.05.2023 - NXP and TSMC jointly develop embedded MRAM IP in TSMC 16 nm FinFET technology With MRAM, carmakers can more efficiently roll out new features, accelerate over-the-air (OTA) updates and remove production bottlenecksNXP’s next generation of S32 zonal . Seite 1
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