TDK announces new ultra-low profile µPOL™ DC-DC converters
• Advanced ultra-low profile packaging and 3D technology are key drivers for next-generation high performance energy efficient designs • High-density solution for space-constrained applications requiring a low-profile power source • Scalable and highly configurable with multi-time programmable memory, offering a wide range of flexibility using Digital Communication (I2C and PMBUS) • Premiering at APEC 2022…
United States Network Storage Georger Brown Convention Center Storage Area Network Digital Communication Convention Center
Source: eejournal.com