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December 13, 2021
Intel is investing $7 billion by expanding and improving its Malaysian semiconductor packaging facility. The new packaging will not only reduce costs but also improve performance and power.
December 13, 2021
On Wednesday Intel will announce a decision to spend $7 billion expanding its packaging facilities in Penang, Malaysia, according to an invitation sent out
December 13, 2021
SANTA CLARA (dpa-AFX) - U.S. chipmaker Intel (INTC) is reportedly planning to invest 30 billion ringgit or $7.1 billion to build a state-of-the-art facility in Malaysia.According to Reuters, the