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China must pursue chip assembly, packaging breakthroughs to catch up with semiconductor leaders, experts say

news China must pursue chip assembly, packaging breakthroughs to catch up with semiconductor leaders, experts say Iris Deng iris.deng@scmp.com ยฉ Bloomberg Chinaโ€™s semiconductor industry has an opportunity to expand by focusing on advanced chip assembly and packaging technologies. Photo: Bloomberg China must pursue breakthroughs in chip assembly and packaging technologies to catch up with global industry leaders, according to experts who spoke on Wednesday at the World Semic...
United States South Korea Xin Yang Wu Hanming Zheng Li Gordon Moore
Source: msn.com

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