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TSMC leads in advanced chip packaging wars, LexisNexis patent data says

Taiwanese chipmaker TSMC has developed the most expansive arsenal of patents surrounding advanced chip packaging, followed by Samsung Electronics and then Intel, according to data from LexisNexis. Advanced chip packaging is a crucial technology that squeezes the most horsepower from the latest chip designs, and is crucial to chip contract manufacturers vying for business. The data from LexisNexis, released last month, indicates that TSMC and Samsung have steadily invested in advanced packaging t
San Francisco United States South Korea South Korean Matthew Lewis Benjamin Ostapuk
Source: aol.com

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