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Purdue s new institute for advanced system integration and packaging honors Boilermaker and innovative visionary in semiconductors

Purdue s new institute for advanced system integration and packaging honors Boilermaker and innovative visionary in semiconductors
purdue.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from purdue.edu Daily Mail and Mail on Sunday newspapers.

Purdue University focuses on semiconductor workforce development - Military Embedded Systems

WEST LAFAYETTE, Ind. Purdue University, long known for its engineering programs, is leaning hard into its emphasis on creating an international footprint in chip technology and microelectronics workforce innovation.

New institute accelerates future of microelectronic system integration, advanced packaging

New institute accelerates future of microelectronic system integration, advanced packaging
purdue.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from purdue.edu Daily Mail and Mail on Sunday newspapers.

Purdue collaborates to bolster rapid technology development in U S

WEST LAFAYETTE – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems. The new institute, announced Wednesda .

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