๐ฐ Microelectronics Packaging News
Microelectronics Packaging News Today
Fast, Ad-Free News Updates
Stay updated with breaking news from Microelectronics Packaging. Real-time updates on events, politics, business and more.
April 7, 2023
This report provides a snapshot of the US Executive Branch priorities via daily schedules and the prior day press releases. POTUS Joseph Biden VPOTUS Kamala Harris The White House The Office of Management and Budget Department of Defense Department of State USAID and More
April 19, 2022
/PRNewswire/ -- The Hong Kong Polytechnic University (PolyU) and The Hong Kong Applied Science and Technology Research Institute (ASTRI) have signed a...
April 12, 2022
HONG KONG, April 7, 2022 /PRNewswire/ -- PolyU and ASTRI join hands to foster research collaboration and nurture R&D talent
April 7, 2022
HONG KONG, April 7, 2022 /PRNewswire/ -- The Hong Kong Polytechnic University (PolyU) and The Hong Kong Applied Science and Technology Research Institute (ASTRI) have signed a Memorandum of
April 7, 2022
/PRNewswire/ -- The Hong Kong Polytechnic University (PolyU) and The Hong Kong Applied Science and Technology Research Institute (ASTRI) have signed a...
April 7, 2022
The Hong Kong Polytechnic University (PolyU) and The Hong Kong Applied Science and Technology Research Institute (ASTRI) have signed a Memorandum of Understanding (MoU) to strengthen collaboration on research and technology transfer as well as to nur
July 8, 2021
Return of the multichip One of the predictions made by Gordon Moore in 1975 during an IEDM keynote where he refined the ideas that gave rise to Mooreรขยยs Law was that chips would get bigger pretty quickly and that this growth would be a major contributor to scaling. He only projected as far as 1980 but his estimates pointed to die area at least doubling in five years: hitting 60 square millimetres by that time. In the mid-2000s, Intel did its best to keep up with the ...