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Resonac : Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60%— Aiming to cope with medium- to long-term increase in demand —

April 04, 2023 Resonac Corporation Resonac Corporation will increase its capacity to produce "Dicing Die Bonding Film," which is a two-in-one adhesive film... | April 4, 2023
Hidehito Takahashi Resonac Corporation Fuji Keizai Group Co Ltd Sd Materials Nantong Co Ltd Resonac Group Company Goi Plant Kashima

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