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Brings expertise in performance and reliability monitoring of die-to-die interfaces to the growing UCIe open chiplet ecosystem HAIFA, Israel, Sept. 20, 2022 /PRNewswire/ proteanTecs

United statesNew jerseyKostenloser wertpapierhandelDebendra das sharmaEvelyn landmanTamar naishlosUcie universal chiplet interconnect express consortiumIntel corporationMicrosoft corporationUcie consortiumQualcomm incorporatedSamsung electronicsTaiwan semiconductor manufacturing companySemiconductor engineering incAlibaba groupUniversal chiplet interconnect express