Page 22 - Nature Electronics News Today

Is this the end of e-waste? MIT engineers have designed a LEGO-like stackable, reconfigurable AI chip that can be snapped onto a device's internal chip.

Although 6G isn't expected to be available until around 2030, these findings mark another step closer toward the technology.

People are used to working with robots in industrial settings. Although this can speed up productivity, there are some health and safety hazards. Therefore, certain robots are kept separate from human personnel. This comes at a substantial financial cost and negatively impacts the interactions between humans and robots.

Researchers have created a new electronic device cooling solution, bypassing heat sinks and TIMs with a conformal copper coating.

A team from the University of Illinois and UC Berkeley has demonstrated a new cooling method that sucks heat out of electronics so efficiently that it allows designers to run 7.4 times more power through a given volume than conventional heat sinks.

A group of researchers is studying a heatsink alternative that involves putting a coat of copper and poly that coats an entire device to help keep it cool.

Researchers at the University of Illinois at Urbana-Champaign and the University of California, Berkeley have recently devised an invention that could cool down electronics more efficiently than other alternative solutions.

Holding the right material at the right angle, Cornell researchers have discovered a strategy to switch the magnetization in thin layers of a ferromagnet – a technique that could eventually lead to the development of more energy-efficient magnetic memory devices.

Hydrogen energy is one tool that could slow climate change, but we aren’t there yet.

April 14, 2022 — Researchers at Intel and QuTech, an advanced quantum computing research center consisting of the Delft University of Technology (TU [...]