Package Technologies News Today

ASIP & S Korean semiconductor co to set up unit in Hyderabad at ₹890 cr. Advanced System in Package Technologies (ASIP), founded by Silicon Valley professionals, has entered into a joint venture with South Korean semiconductor player APACT for setting up an outsourced semiconductor assembly and test services (OSAT) facility in Hyderabad at an investment of 890 crore.

ASIP and APACT have partnered to establish a hi-tech semiconductor assembling and testing facility in Hyderabad, aiming to contribute to Indias semiconductor manufacturing growth. They have also signed an MoU with IIT Hyderabad for R&D collaboration in the OSAT industry.

OSAT (Outsourced Semiconductor Assembly and Testing) and ATMP (Assembly Testing Marking and Packing), Hyderabad facility will serve India’s growing domestic needs, and provide an alternate supply chain to the global ecosystem.

India News: HYDERABAD: Advanced System in Package Technologies (ASIP), founded by Silicon Valley professionals, has entered into a joint venture with South Korean.

Brandon Zurawlow, CS Analytical CSO, to Present Helium Leak Detection Educational Webinars for PTI Share Article The two-part webinar series is designed to provide participants with insights on helium leak detection and best practices for implementation as part of comprehensive USP 1207 CCI strategies expected by regulatory agencies. Working with instrument manufacturers such as PTI to share our knowledge and experience in an objective and educational format is core to the mission of CS Analyti...