Page 2 - Packaging Lab News Today

In order to realise vision of Prime Minister Shri Narendra Modi to turn India into a thriving semiconductor hub, multiple number of agreements/pacts have been announced on third and last day of SemiconIndia 2022. The SemiconIndia 2022, a 3 day confer

Login or register now to gain instant access to the rest of this premium content! Pictured is Indiana State University senior packaging engineering technology major Cole Weathers. Weathers credits his hands-on learning experiences with Esko software in the classroom and in ISU’s Packaging Lab for helping him secure a position with Welch Packaging, based in Elkhart, Ind., upon graduation in May. Indiana State University received a multi-million-dollar in-kind gift of package engineering techno...

Expanding the Use of Flexible Packaging  Read more. Hunter’s® Gourmet – Quinoa Chips by Emirates Printing Press, LLC— Packaging Excellence, Printing, Shelf Impact  Read more. GOLD AWARD, SUSTAINABILITY—Industrial Compostable Coffee Pod Lidding & Mother Bag by TC Transcontinental Packaging Industrial Compostable Coffee Pod Lidding & Mother Bag by TC Transcontinental Packaging—