Circuits Assembly Online Magazine - Indium Corporation's Sze Pei Lim to Present at ICEP Japan
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto, Japan, on April 19. The presentation will cover the findings from a technical paper, co-authored by R&D Manager for the Alloy Group HongWen Zhang, titled An In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305.
National University Of Singapore Singapore General South Korea United Kingdom Mike Buetow Indium Corporation
Source: circuitsassembly.com