Page 13 - Packaging Technology News Today

CHICAGO, Dec. 2, 2022 /PRNewswire/ -- The global SOI market size is estimated to be USD 1.4 billion in 2022 and is projected to reach 2.9 billion by 2027, at a CAGR of 15.0% during the forecast

Processed Meat Packaging Market is anticipated to reach US$ 2.4 bn in 2032, growing at a 4.8% CAGR between 2022 – 2032

Queen Elizabeth Commonwealth Scholarships (QECS) 2023/2024 for Master’s degree study in a low or middle-income Commonwealth country. (Fully Funded)

Unified Flex Packaging Technologies targets startups with its versatile vf/f/s.

/PRNewswire/ -- Semiconductor Packaging Materials Market Research Report by Type, Packaging Technology, Region - Global Forecast to 2027 - Cumulative Impact of...

/PRNewswire/ -- Semiconductor Packaging Materials Market Research Report by Type, Packaging Technology, Region - Global Forecast to 2027 - Cumulative Impact of...

Four professionals will be inducted into the Hall of Fame Class of 2022 during PACK EXPO International. Honored will be Jean-Jacques Graffin, Rebecca Oesterle, Pierre Pienaar, and Jeff Rhodehamel.

Four professionals will be inducted into the Hall of Fame Class of 2022 during PACK EXPO International. Honored will be Jean-Jacques Graffin, Rebecca Oesterle, Pierre Pienaar, and Jeff Rhodehamel.

AMD shows off the GPU block diagram for its Instinct MI250X: MCM GPU, 58 billion transistors, TSMC 6nm process node, 128GB of HBM2e memory.

If patent holders want to exclude others from using their invention, then they need to keep an eye on the marketplace to spot infringers. Because the metaverse opens up a new, virtual...