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April 19, 2024
SARANAC LAKE — Ogdensburg native Valerie Patterson won the Peoples Choice award at the annual juried show at the Adirondack Artists Guild for her watercolor painting, "That Persistent Memory." …
September 21, 2023
The Vara Mainnet, an innovative stand-alone layer-1 decentralized network built on the robust Gear Protocol, has announced its launch.
August 4, 2023
There's a warning about complacency for TSMC, a Gartner Hype-Cycle for 2023, the foundation of the Semiconductor Education Alliance, a thought piece on robotic patent wars, and Huawei planning to fab 5G chips on a 7nm process at SMIC this year...
July 28, 2023
Gartner’s 2023 Storage Hype-Cycle sees the demise of Storage Class Memory (thanks to Intel canning Optane), Copy Data Management, Enterprise Information
May 24, 2023
Dublin, May 24, 2023 (GLOBE NEWSWIRE) -- The "Magneto Resistive RAM (MRAM): Global Strategic Business Report" report has been added to ...
January 7, 2023
Intels Crow Pass gets detailed: 3 GB/s random bandwidth, 6 GB/s sequential bandwidth.
August 16, 2022
New joint composable solutions deliver software-defined, low-latency data centers with the ability to pool and orchestrate for DRAM-like data speeds.
August 8, 2022
Buried in Intel’s recent and somewhat dismal second-quarter 2022 financial results was a line item under “Non-GAAP adjustment or measure” that read: “Optane inventory impairment” for the sum of $559 million. Ouch. About 60 percent of the way through the “Forward-Looking Statements” section of the financial earnings statement is the phrase “the wind-down of our…
July 28, 2022
Over the last two issues, we’ve described the history of integrated circuits (ICs), the manufacturing process, process nodes, wafer sizes and EUV lithography. Along with EUV, another technology that is just maturing and has fundamentally changed the way high-end ICs are made is multi-chip modules. We shall now investigate that and other cutting-edge chip technologies. by Dr David Maddison