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Heraeus Electronics Provides Latest Materials Portfolio for Next-Generation Power Electronics and Semiconductor Advanced Packaging at NEPCON Japan 2023

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.
Megan Craig Semiconductors Industry Heraeus Electronics Ic Sensor Packaging Technology Expo Tokyo Big Sight Die Top System

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