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APAC is the fastest-growing regional semiconductor bonding market between 2022-2028. Canada, France, rest of APAC, South Korea, the UAE, and Brazil are the.

United statesSouth koreaSaudi arabiaUnited kingdomSouth africaAnkit mathurRobert bosch gmbAsia pacificPacific technologyKulicke soffa industries incAllegro microsystems incHoneywell international incGlobal semiconductor bonding market report scopeQualcomm technologies incInternational energy agencySemiconductor bonding market size