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Akoustis Locks Process Flow For Second Wafer Level Package For XBAW Filters

Akoustis Locks Process Flow For Second Wafer Level Package For XBAW Filters New Packaging Solution Addresses the Small Form Factor Requirements for 5G Mobile and WiFi 6E Devices Packages Will Be Manufactured Both In-House and in Outside Supply Chain to Provide Rapid Prototyping and Flexible Capacity Micro Package Compatible Across XBAW Filter Product Line for 5G Mobile, WiFi and Network Infrastructure Charlotte, NC (GLOBE NEWSWIRE) - Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has locked the process flow for its second chip scale package (CSP). The new CSP technology supports the Company’s XBAW® filter products across the 5G mobile, WiFi mobile and CPE and network infrastructure markets.

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