Samsung Electronics’ semiconductor business narrowed losses in the third quarter compared to the previous quarter, thanks to increased sales of high-priced products such as high-bandwidth memory (HBM), mainly for AI chips and DDR5 DRAM chips as well as chip price increases, the company said Tuesday.
Samsung Electronics, the world’s largest memory chipmaker, on Tuesday unveiled a new foundry business road map, saying it will expand the adoption of the 2-nanometer manufacturing technology in phases to mobile applications by 2025, high-performance computing by 2026 and automotive chips by 2027. The bold plan comes as Samsung, a distant No. 2 in terms of foundry sales after Taiwan Semiconductor Manufacturing C.
Samsung Electronics plans to catch up with Taiwan s TSMC in the foundry business by starting mass production of 2-nanometer mobile chips in 2025, the Korean chip giant announced at the Samsung Foundry Forum held in San Jose, Calif., Tuesday (local time). During the forum, Samsung said it will continue to expand the use of the 2-nanometer process to high-performance computing (HPC) chips in 2026 and automotive semiconductors in 2027.