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Circuits Assembly Online Magazine - Five Indium Corporation Experts to Present at IPC APEX Expo

Indium Corporation’s technical experts will share a variety of presentations on topics ranging from e-Mobility, achieving low voiding through solder preforms, high-performance metal thermal interface materials, low-temperature solder alloys, and low-temperature solder paste for wafer-level packaging at IPC APEX Expo, Jan. 24-26, San Diego, Calif., U.S.
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Circuits Assembly Online Magazine - EV Experts to Share Technical Insights in High-Density Assemblies Webinar

As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion™ Technical Webinars, Indium Corporation’s Jonas Sjoberg, associate director for global technical service & application engineering, and Ângelo Marques, applications engineer – design for excellence (DfX) specialist, will share considerations for the implementation of high-density assembly in the automotive space.
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