Global 3D IC and 2.5D IC Packaging Market to Reach $6.4 Billion by 2030
Global 3D IC and 2.5D IC Packaging Market to Reach $6.4 Billion by 2030. In the changed post COVID-19 business landscape, the global market for 3D IC and 2.5D IC Packaging estimated at US$3.3 Billion in the year 2022, is projected to reach a revised size of US$6.4 Billion by 2030, growing at a CAGR of 8.7% over the analysis period 2022-2030.New York, July 03, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global 3D IC and 2.5D IC Packaging Industry" - ht...
United Kingdom New York United States Customer Support Center Year Perspective For Consumer Electronics Packaging Technology Market Share
Source: yahoo.com