Physicist Develops Single-Shot Technique for Semiconductor Analysis
A novel technique for the thorough characterization of semiconductors in a single measurement has been developed by an HZB physicist.
Source: azooptics.com
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Unique X-ray Topography Based Defect Characterization for SiC Wafers Honored with Georg Waeber Innovation Award 2023
A cross-organizational team from Rigaku SE and Fraunhofer IISB has established a new semiconductor material characterization method in their jointly operated Center of Expertise for X-ray Topograp ...
Michael Hippler Christian Kranert Christian Reimann Materials Department V Microelectronics Promotion Society Nuremberg Chamber
Source: chemeurope.com