Page 4 - Semiconductor Engineering Inc News Today

The Environmental Protection Administration (EPA) yesterday invited electronic component manufacturers to participate in its “industrial plastic recycling network,” to encourage businesses to recycle at least 75 percent of their plastic waste, up from 65 percent currently. Taiwan’s industrial sector produces more than 240,000 tonnes of plastic waste per year, but only 67,200 tonnes — or 28 percent — is recycled, it said. Whereas past efforts have focused on reducing plastic waste gener...

VeriSilicon is one of the first enterprises in mainland China to join the organizationand will work with other members on research and adoption of the UCIe 1.0 Specification and the nextgeneration of UCIe technology.VeriSilicon’s participation will support development of its chiplet-based technology and associated products.

Press release content from Business Wire. The AP news staff was not involved in its creation.

Membership will drive VeriSilicon's industrialization of chiplet-based projects and support aim of becoming a leading provider of commercialized chipl

Leading tech companies have formed an industry consortium to develop a standard interconnect scheme for chiplets,

Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

A group of top chip companies has developed the Universal Chiplet Interconnect Express standard, or UCIe, to help create modular chips that would act like today's PCs but at the chip level.

A consortium of tech industry heavyweights today announced the Universal Chiplet Interconnect Express (UCIe) industry consortium with a mission to [...]

Remember how AMD and Intel co-created the "Kaby Lake G" chip? UCIe would theoretically allow virtually any chip company to do the same.

A new industry consortium – Universal Chiplet Interconnect Express (UCIe) – has formed to establish a die-to-die interconnect standard in support of an