Page 12 - Semiconductor Engineering News Today

MicroLEDs continually demonstrate performance benefits for displays, including higher contrast and brightness, greater pixel density and wider color gamut. MicroLEDs facilitate enhanced visual performance in ambient light conditions, from complete darkness to broad daylight and when viewed from multiple viewing angles. These characteristics make microLEDs particularly attractive for applications including mobile phones and smart-watches, automotive display panels, augmented and mixed reality (...

Shortages, Challenges Engulf Packaging Supply Chain Innovative business models emerge, but so does possibility of consolidation. A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will rema...

ASE has developed an assembly design kit (ADK) that helps customers using ASE’s Fan Out Chip on Substrate (FOCoS) and 2.5D Middle End of Line (MEOL) technologies to make use of the full Siemens HDAP design flow. ASE and Siemens have extended their partnership to include the future creation of a single design platform from FOWLP to 2.5D substrate design. All of these use the Xpedition Substrate Integrator software and Calibre 3DSTACK platform that Siemens acquired from Mentor Graphics. “By a...

FOWLP Market has been studied by “Big Market Research” in terms of all parameters such as applications, types, products and many other. Each and every

By Eric Hamilton Published February 03, 2021 at 3:40 am This week, we’re covering Intel’s GPU getting a showcase, the Right to Repair movement gaining an impressive amount of traction among the states for 2021, and new product launches. On the Right to Repair front, several states will be proposing bills aimed at addressing repair laws, and the next few weeks and months will be interesting as these bills potentially get off the ground. We’ve also got some ne...

Moores Law is almost dead on January 26, 2021, 16:24 Why it matters: The transition from planar transistors to FinFET was enough to keep Moores Law relevant for the last 10 years, but even that design is running out of steam. Gate-all-around transistors look promising for 3 nm and beyond, but that transition could be the costliest yet. While most advanced chips today are manufactured on a 7 nm or 5 nm process node, large foundries like TSMC and GlobalFoundries have been bu...

The supply chain could struggle to keep pace with surging demand this year.

HiRobot Technology Co., Ltd.: [Big News] United Capital Closed a Strategic Investment in HiRobot, Aiming to Jointly Launch the 1st IPO Project in Intelligent Security Robot Industry United Capital and HiRobot Technology Co., Ltd. formally signed an investment agreement. As a strategic investor, United Capital will work together with HiRobot to build a leading integrated service platform in the multidimensional security robot industry, aiming to go public in three years and become the first st...