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Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem

Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.
Partha Ranganathan Mandy Rose Mark Papermaster Leendert Van Doorn Vijay Rao Lihong Cao

SKKU: 2021 SAMSUNG Institute of Technology Graduation Ceremony

The 2021 graduation ceremony of Samsung Institute of Technology (President Gye-Hyeon Kyung), which has signed an academic exchange agreement with Sungkyunkwan University, was held on February 22, 2022. Through this graduation ceremony, six Ph.D.s and
Gye Hyeon Kyung Dong Ryeol Shin Samsung Institute Of Technology Samsung Institute Of Technology Is Korea Department Of Semiconductor Sungkyunkwan University

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Research and Markets: European Advanced Packaging Industry to 2031 - Featuring Amkor Technology, Intel and Qualcomm Technologies Among Others

The "Europe Advanced Packaging Market 2021-2031 by Product Type, End User, and Country: Trend Forecast and Growth Opportunity" report has been added to ResearchAndMarkets.com's offering. The European
United States Laura Wood Amkor Technology Inc Intel Corporation Brewer Science Inc Chipbond Technology Corporation

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