Sensofar and Linkam Develop New Technique for Characterising the Temperature-Induced Topographical Evolution of Nanoscale Materials
Written by AZoNanoMay 13 2021
Sensofar, a technology company specialising in the field of non-contact surface metrology, has developed a new technique for characterising the evolution of a sample’s surface topography with temperature using the S neox 3D optical profiler and Linnik interferometer coupled with Linkam’s LTS420 temperature-controlled chamber. The technique has been used to successfully map the changes in roughness and waviness of silicon wafers at temperatures up to 380°C.
The Linkam LTS420 – Sensofar’s S neox system with Linnik in use in the lab. Image Credit: Sensofar