The groundbreaking ceremony for the first chip packaging unit in India Micron Technology was held in Sanand, Gujarat, in the last week of September this year.
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Jaya Jagadish, Country Head & SVP, AMD India said, “HPC & AI are fundamentally re-defining the world of technology and AMD is at the center of this evolution with our expansive portfolio of computing products. The research partnership with IISc, in these areas will help our engineers find new ways tooptimize our products to tackle some of the world’s toughest challenges”.