Page 104 - Smc News Today

Intel CEO Pat Gelsinger says at Hot Chips 34 that the company wants to hit 1 trillion transistors on a single package by 2030, Foveros will help them.

Birentechs new BR100 GPU is the best China has in its arsenal: 77 billion transistors, 7nm process node, 64GB of HBM2e at 2.3TB/sec, PCIe 5.0 and 550W.

Intels gigantic silicon manufacturing plant in Ohio needs 7000+ workers to construct it, massive $20 billion job will be finished by 2025 or so.

This alleged AMD Ryzen 5 7600X engineering sample has a 4.4GHz base CPU clock, retail 6-core Zen 4-powered CPU expected to boost up to 5.3GHz.

NVIDIAs new Grace CPU detailed: 72 Arm v9.0 cores per chip, 117MB of L3 cache, 68 x PCIe 5.0 lanes, TSMC 4N process node, and 500W TDP.

A week after Pelosis visit, five US lawmakers, led by Senator Ed Markey, travelled to Taiwan, , semiconductors, taiwan, tsmc, Arizona

Intel teases Foveros 3D packaging technology: Meteor Lake-P CPUs in 2023 laptops teased with 6P+8E CPU diagram showed off at Hot Chips 34 conference.

Apples next-gen M2 Pro and M2 Max SoCs were destined for TSMCs new 3nm process node, but according to Ming-Chi Kuo, Apple will use TSMCs 5nm instead.

However hard the Biden administration tries to counter Chinese chip manufacturing, there is a key factor it fails to take into account: talent flow. The US can ban the sale of technology to China. But it cannot stem the flow of global, including US-trained, tech talent to China.

AMD shows off the GPU block diagram for its Instinct MI250X: MCM GPU, 58 billion transistors, TSMC 6nm process node, 128GB of HBM2e memory.