Page 17 - Smc News Today

Intel's advanced-packaging services may have scored a major new customer if a report out of Taiwan is accurate.

Sony's beefed-up PlayStation 5 Pro console rumor: 4nm Zen 2-based 8-core CPU, 60 CUs on full die for GPU, 56 CUs planned for now with 16GB GDDR6 18Gbps.

SK Hynix: The companys new packaging plant in Indiana will specialise in stacking standard dynamic random access memory chips to create high-bandwidth memory (HBM) chips, before integrating them with Nvidias graphic processing units (GPUs), the report said, citing sources.

Siltronic: The company, whose customers include Intel, TSMC and Samsung, reported preliminary 2023 revenue of 1.5 billion euros ($1.6 billion), matching analysts average forecast in a poll by Vara Research.

People familiar with SK Hynix's plans said the HBM created in Indiana will be paired with Nvidia GPUs. Existing HBM chips from SK Hynix are manufactured in...

Nvidia could choose Intel Foundry Services as a new partner for GPU manufacturing in the next few months. According to rumors from unnamed industry sources, Nvidia is...

The Amphibious Combat Vehicle 30mm Canon (ACV-30) will provide the US Marine Corps (USMC) with substantial firepower when landing and is one of four types being manufactured for the force.

Intel's next-gen Nova Lake CPUs will be the biggest architectural uplift in Intel history, bigger than the Core architecture, made on TSMC 2nm node.

NVIDIA has reportedly moved to Intel for advanced packaging of its next-gen AI GPUs to stop shortages, the company is bottlenecked by TSMC's CoWoS tech.

Investors are losing patience in the chipmaker's turnaround plans.