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Micron UFS 4.0 Mobile Storage Built on 232-Layer 3D NAND Delivers Industry's Fastest Performance for Smartphones

Best-in-class mobile flash solution optimized for AI and 5G data-intensive flagship smartphonesBOISE, Idaho, June 21, 2023 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) announced today that it is now delivering qualification samples of its Universal Flash Storage (UFS) 4.0 mobile solution, built on its advanced 232-layer 3D NAND. Offered in high capacities up to 1 terabyte (TB), the UFS 4.0 storage solution is being shipped to select global smartphone manufacturers and chipset vendors
United States Mark Montierth Micron Technology Inc Universal Flash Storage Mobile Business Micron Technology
Source: yahoo.com

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