ASE unveils chiplet packaging solutions aimed at AI, auto uses
Taipei, Nov. 4 (CNA) The world's largest IC packaging and testing service provider, ASE Technology Holding Co., has introduced advanced packaging solutions for chiplets that are targeted for use in artificial intelligence, automotive electronics, high performance computing devices and 5G applications.
T Ai Pei Frances Huang Chung Jung Feng Technology Holding Co Semiconductor Engineering Advanced Semiconductor Engineering
Source: focustaiwan.tw