MOUNTAIN VIEW, Calif., April 27, 2021 /PRNewswire/ Highlights of this Announcement: Strategic collaboration leverages all of Synopsys' platform solutions, silicon IP and reference flows to accelerate Arm's most advanced and high-performance processor designs Synopsys Fusion Design Platform and Verification Continuum Platform enable rapid development and best-in-class PPA metrics for Neoverse V1 and N2 cloud-to-edge infrastructure cores…
Industry Leading Productivity
IC Validator is a comprehensive and high-performance signoff physical verification solution that improves productivity for customers at all process nodes, from mature to advanced. IC Validator offers the industry’s best distributed processing scalability to over 4,000 CPU cores. The tool’s performance and scalability enabled some of the industry’s largest reticle limit chips with billions of transistors, same-day design rule checking (DRC), layout versus schematic (LVS), and dummy fill turnaround time.
IC Validator physical verification is seamlessly integrated with the Synopsys Fusion Compiler™ RTL-to-GDSII solution and IC Compiler® II place and route system in the Fusion Design Platform. This integrated fusion technology accelerates design closure for manufacturing by enabling independent signoff-quality analysis and automatic repair within the implementation environment.
Synopsys Receives Customers Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform Ecosystem Forum
MOUNTAIN VIEW, Calif., Feb. 9, 2021 /PRNewswire/  Synopsys, Inc. (Nasdaq: SNPS) today announced it received the Customers Choice Award for a technical paper presented at the TSMC 2020 North America Open Innovation Platform
® (OIP) Ecosystem Forum. The paper, titled 5nm Node Enablement and Maximizing QoR Using Fusion Compiler
â¢, was developed and presented by Henry Sheng, group director of Engineering at Synopsys. The paper won the award based on the popular vote by conference attendees and can be downloaded on TSMC.com.  Our customers appreciate Synopsys sharing their technical knowledge and expertise in enabling the next-generation designs in fast-growing mrkets such as 5G, mobile and automotive, said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. I m pleased to congratulate Synopsys as the winner of th